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Wafer Level Chip Scale Packaging (WLCSP) designs, including Wafer Level Fan-Out (WLFO) technologies, are gaining more and more applications for next generation small and thin devices. Since the WLCSP and WLFO packages are mounted directly on the motherboard without a substrate as a buffer, the large coefficient of thermal expansion (CTE) mismatch between the silicon die and the motherboard makes the...
Rising with consumer electronics, mobile and wearable devices electronic packaging is developed with high power, high I/O, small size and good reliability performance. Among the various packages adopted by industry, Wafer Level Chip Size Packaging (WLCSP) and Ball Grid Array (BGA) possess characteristics mentioned above and therefore widely used in various kinds of devices. However, concerning different...
The wafer level chip scale package (WLCSP) has been widely used in mobile chipset applications since it provides a strong solution to satisfy the demands for smaller form factor, multifunctional and low cost devices. As WLCSP moves towards lower cost, higher performance and finer pitch designs to meet the increasing requirements of electronic products, there are a number of challenges in preventing...
Solder joints are commonly used in the electronic packaging industry to provide electrical connection and serve as the mechanical support between a package and a printed circuit board (PCB). A coefficient of thermal expansion mismatch between component and board generates thermally induced strains in solder joints because of environmental temperature change, which ultimately causes fatigue failure...
In this paper, thick film chip resistors with two different types of solder alloys namely SnPb and SnAgCu have been evaluated for the effects of the solder alloy elemental composition on the solder joint failures under cyclic temperature loading conditions. The creep properties of both solders have been modelled using the Garofalo equation and the creep strain energy density has been extracted and...
Deterministic approaches may predict the life of solder joint interconnects used in microelectronic devices far different from the test results and field environment. This difference is caused by uncertainties introduced in finite element and damage modeling with different random variables such as material properties, geometry, damage model constants, and many others. This paper presents a methodology...
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