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Packages of commercial Gallium-Nitride power semiconductors present increasingly small dimensions to enable low parasitic inductance, increasing the heat flux density of the package and the challenges associated with their thermal management. This paper compares between Printed Circuit Boards and Direct Copper Bonded as substrates for a Gallium Nitride based half-bridge from a thermal and reliability...
3-D technologies with stacked chips have the potential to provide new chip architecture, and improved device density, performance, efficiency, and bandwidth. The increased power density in 3-D technologies can become a daunting challenge for heat removal. Furthermore, power density can be highly nonuniform, leading to time- and space-varying hotspots, which can severely affect performance and reliability...
In this paper several heat dissipation mechanisms are studied in an effort to improve heat dissipation of a high-power packaged chip in its environment. Specifically we examine a cavity-down structure consisting of a copper plate in thermal contact with the back side of the chip. In order to evaluate the thermal performance of the cavity-down approach, three structures are compared via simulation...
High power electronic modules, such as IGBT modules, are required in many applications, like the high speed train, solar energy inverter, CNC, frequency-alterable air-conditioner, etc. When a module works, a lot of heat would be generated due to the small size. If the heat could not be removed from the module, the high heat flux might lead to failure of the module. Therefore, a good thermal management...
Thermal design of PCBs (Printed Circuit Boards) is important for electronic packages which are intended to be primarily cooled by heat flow into the PCB. Designing the required PCB coverage area through detailed numerical simulations can be computationally expensive. This article presents a quick approach to predict Junction-to-Air thermal resistance of exposed pad packages based on pre-generated...
Heat pipe embedded aluminum silicon carbide (AlSiC) plates are innovative heat spreaders that provide high thermal conductivity and low coefficient of thermal expansion (CTE). Since heat pipes are two phase devices, they demonstrate effective thermal conductivities ranging between 10,000 and 200,000 W/m-K, depending on the heat pipe length. Installing heat pipes into an AlSiC plate dramatically increases...
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