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In this paper, thermo-mechanical reliability of a three-dimensional (3D) package based on through-silicon-via (TSV) under different thermal cycling was investigated with finite element method. A finite element simulation of this 3D package was performed in order to compare the thermal stress and fatigue lives of the solder joints with and without underfill. It was found that the fatigue live of solder...
In this paper, thermo-mechanical reliability of a three-dimensional (3D) package based on through-silicon-via (TSV) under different thermal cycling was investigated with finite element method. A finite element simulation of this 3D package was performed in order to compare the thermal stress and fatigue lives of the solder joints with and without underfill. It was found that the fatigue live of solder...
While in the past, the silicon, package and system could be designed sequentially, at silicon nodes less than 40nm, the interconnects between the chip, package and system are becoming the limiting factor in performance and reliability. To better capture the warpage and fatigue, an improved slice model with much more detail about the bumps, microbumps, underfill, fillet etc., was simulated. The silicon...
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