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The current method of communicating process capabilities to the designer is in the form of ground rules. However, due to constraints on the complexity and number of rules, there may exist shapes that are design-rule clean but difficult to manufacture. This problem is exacerbated in local routes drawn on 1x metal (M1) which allows highly bi-directional shapes at tight spacing. On the other hand, local...
Power delivery network (PDN) design is becoming even more critical with the advent of progressively complex environments on and beyond the die. Multicore chips, mixed-signal designs with multiple reference voltages, and complex 3D packaging situations lead to complicated PDN geometries with high-frequency demands and sharpening edge rates even when on-core frequencies are relatively constant. Early...
Open defect is one of the most common defects in CMOS integrated circuits ICs. For a precise and realistic testing and diagnosis of this defect, it becomes mandatory to extract its location and segments that disconnects from circuit's layout. However, current defect extraction algorithms are limited to bridging faults extraction. In this paper, we present a novel algorithm to extract potential open...
As the continual decrease of the feature size, the parasitic inductance and capacitance effect play important role in IC design and verification. Previous works on layout extraction mainly concentrated on how to find out the type of devices and connections between them, few works has addressed the information of centerlines and widths of IC interconnects in a polygon-based VLSI layout, which are required...
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