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We propose a built-in test circuit to detect resistive open defects occurring at interconnects between dies of 3D ICs. The test circuit consists of an I-V converter and a comparator of offset cancellation type. Feasibility of the tests with the circuit is examined by SPICE simulation. It is shown that resistive open defects of 5Ω and above can be detected per 240nsec under process variations of MOSs...
In this work, low temperature of 200 °C, low pressure of 0.1MPa, fluxless and plateless Cu-Cu bonding in SiC power module is achieved by the transient phase liquid sintering (TLPS) of Cu nano particle and Sn-Bi eutectic powder. In this paper, shear strength at room temperature and 150 °C of two compositions of Cu mixed with Sn-Bi is investigated and the factor influencing the shear strength at 150...
Cu to Cu bonding technology of IC package has the potential to replace solder joint in Future trends. The Cu to Cu bonding technology compared with other joint methods for IC package, it can solve the reliability problems such as electromigration, brittle intermetallic compound or other issues. At present, Cu to Cu bonding methods have been wide developed, but the microcosmic mechanisms of Cu to Cu...
We investigate theoretically and experimentally the factors to influence on the core height when the Mosquito method is applied. Using the simulation analysis, we find a correction method to align the core height accurately.
In this paper, we focus on the coupling loss of polymer waveguide based optical links, which exhibits a serious impact on the power budget in such a short-reach link. In particular, the optimum core size of polymer waveguides for the low coupling loss with VCSELs and PDs with small effective area is investigated both theoretically and experimentally.
This paper designs a System-in-Package (SiP) device with DSP + FPGA + ADC as the basic architecture. The diffusion thermal resistance model of SiP devices is established, which reduces the thermal resistance of the device by using special encapsulation materials and high heat transfer efficiency. At the same time, the temperature grade of SiP devices is improved. The laboratory temperature test shows...
Bonding dynamics during ultrasonic bonding of Cu free air ball (FAB) is investigated by measuring dynamic strain with piezoresistive strain sensor. Change in dynamic strain with elevating substrate temperature up to 200°C was investigated. It was clearly observed that elevating substrate temperature significantly enhanced deformation of the Cu FAB while the application of pressing load and ultrasonic...
To realize free optical wiring patterns on printed circuit boards (PCBs), polymer shuffling optical waveguides are fabricated, in which both crossing and curved core structures are combined. The obtained GI polymer shuffling waveguides show low insertion loss independent of the crossing angle and core size. The GI-core polymer shuffling waveguide is a key device for low loss and high density on-board...
In this study we investigated the effect of chemical etching process of a steel plate (SPCC) by phosphoric acid (H3PO4 aq. (10wt%) at 30–60°C for 300–1200s) on the surface morphology in order to enhance the welding strength of a carbon fiber reinforced thermoplastic (CFRTP) plate and the preprocessed SPCC plate joined by ultrasonic welding. As a steel plate was pre-processed, the open pores were obtained...
Utilizing hydrogen radicals as a reducing agent, reflow of indium solder paste printed on chips were conducted. Where hydrogen gas treatment failed to form indium solder bumps at 250 C, it was shown indium solder bumps were successfully formed at temperatures as low as 170 C.
This paper reports on a large-size CPU package for UNIX servers which employs embedded thin film capacitor layers. The substrate of this package has two thin film capacitor layers in the surface of the core layer, which has a capacitance of 25 uF in total. In order to adopt this package substrate, we confirmed the effect of the thin film capacitor layers on the package assembly process. We actually...
This paper demonstrates that our very thin film STO capacitor can be located under re-distribution layer (RDL) of WLP/FO-WLP package and is effective for reduction of the power supply noise of LSIs. Their Shmoo plots show improvement of operable frequency and power supply voltage reduction, as results of the improved power integrity realized by our Sub-RDL STO thin film capacitors.
2.1D package technology (chip on substrate) as a potential low cost solution for 2.5D silicon interposer package (chip on wafer on substrate), we develop here a panel type manufacture organic interposer (scheme 1). 2.1D technology focus on the production cost and the ball count range which defined by line/space. We presents the demonstration of high resolution photolithography semi-additive processes...
This paper represents 3-dimensional crossing structures of multimode polymer optical waveguide with graded-index (GI) circular cores for optical printed circuit boards (OPCBs), which are fabricated using the Mosquito Method. In this waveguide, the cores are aligned with a 250-pm inter-channel pitch containing both horizontally and vertically bent structures, where the last 6 channels are crossing...
Circular-core single-mode polymer waveguides with a graded-index profile were designed and fabricated using the Mosquito method. Their optical characteristics and high speed performance were evaluated with a data rate of 25 Gb/s at 1550 nm.
Polymer waveguides incorporated with europium (Eu)-aluminum (Al) polymer composite are fabricated by applying the Mosquito method. The optical amplification gains of the fabricated waveguides with different lengths are measured under a coaxial pumping condition. It is found that the pumping efficiency tends to decrease with increasing the waveguide length. In order to improve the efficiency, the core...
Polymer waveguide based hybrid photonic technology allows for integration of lasers, receivers, wavelength splitters/combiners, polarization-handling elements, and several other optical functionalities. An overview of HHI's Poly Board photonic integration platform is given, showing its potential for various application fields such as telecom/datacom, sensing, and active optical printed circuit boards.
GaN-HEMT achieves the reduction in size and weight of power conversion circuits, thanks to its high frequency switching characteristics. However, the switching speed and low threshold voltage may cause a false turn-on phenomenon, which is a fatal effect for the applications. It is urgent issue to tackle and avoid this problem by modifying the circuit conditions. In this letter, the theoretical analysis...
An overview on the recent progress of Si insulated gate bipolar transistors (IGBTs) and SiC MOSFETs as key components in today's power electronic system is given. The state-of-the-art device concepts are explained as well as an outlook about ongoing and foreseeable development steps are shown.
This work is the first to achieve a low temperature (≦250 °C) and low pressure (≦0.1 MPa) fluxless bonding of plateless Cu-Cu substrates by transient liquid phase sintering (TLPS) of Ag nanoparticles and Sn-Bi eutectic powder. Sintering was conducted under formic environment to assist the wetting of Sn-Bi and to suppress the oxidation of Cu substrate. Effect of mixture composition to the shear strength,...
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