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This paper reviews recent advances in high speed short reach optical interconnects for Datacom links from the perspective of Ethernet applications, fiber development and system experiments based on the multimode-VCSEL paradigm.
This work proposes a broadband microstrip patch antenna array with H-shaped aperture-coupled stacked rectangular patches is implemented to low-cost and low-loss organic substrate for flip chip chip scale (FCCSP) package for millimeter-wave antenna in package (AiP) application. The proposed antenna array is built on a low-cost and low-loss multilayer organic substrate for flip chip chip scale (FCCSP)...
A 3D packaging based 4-channel X-band receiver module is implemented using low temperature co-fired ceramic (LTCC) technology. A dual-mode X-band bandpass filter (BPF), an lumped-element branch-line coupler and an lumped BPF is proposed for the receiver module, respectively. The overall size of the module is only 54 mm × 60 mm × 1 mm. The measured gain parameter, noise figure (NF), image rejection...
In this paper, a wideband bandpass filter (BPF) with very compact circuit size is proposed. Specifically, the circuit size of a 5th-order multi-mode resonator BPF is largely reduced by replacing all transmission line sections with bridged-T coils. The resulted lumped-element BPF can then be implemented using the integrated passive device technology to achieve very compact chip size. To improve also...
A compact narrow-band low temperature co-fíred ceramic (LTCC) filter with a fractional bandwidth of 3% is proposed. The proposed filter consists of five cascaded half-wavelength resonators vertically arrayed on each LTCC layer. End-coupling between adjacent resonators is precisely controlled by rectangle-shaped slot on intermediate ground layer. The overall size of the filter is only 8 × 6 × 0.89...
Fan-Out Panel Level Package (FOPLP) is well-known process to extend for Fan-Out Wafer Level Package (FOWLP) efficiently in terms of area-fill factor, large-area processability and manufacturing cost. However, they typically require us many unique and novel equipment and thus enormous initial cost tremendously. Here we report new FOPLP manufacturing processes involving single-sided adhesive tapes....
Heat pipe is a best known passive cooling & heating device which is excellent in heat transfer and low thermal resistance. Basically, heat pipe is a two-phase heat transfer device using latent heat. Heat pipe is a device of very high thermal conductance and its equivalent thermal conductivity can be several hundred times higher than that of a solid copper rod of the same dimensions. Currently,...
A new sink should be in simple shapes for reasonable manufacturing process. On the other hand, the heat sink tends to be complicated shape for high cooling performance. Recently, 3D printer is able to process complicated shapes. However, manufacturing cost by 3D printing method is expensive. Thus it is important to verify and improve fluid flow and thermal conductivity at the design stage of the heat...
This paper introduces a thermal design method for 3D integration, using stacked thermal chips consisting of 100 polysilicon heaters in a 30 mm by 30 mm area on each chip to verify thermal models. For each heater, two levels of thermal load can be selected. Thermal effects from hot-spots in stacked chips were measured and verified in simulation results. Through this investigation, thermal models with...
In this paper the CEA LETI proposes a silicon test vehicle and method to quantify the degradation of packaging in a biological medium. Those developments are suited for medicals devices which are potentially in contact with human cells. Different solutions of encapsulation, performed at the wafer level in clean room, are presented and compared. Test vehicles were made on silicon wafer including AlSi,...
Fan-Out Wafer Level Packages (FOWLPs) and Fan-Out Panel Level Packages (FOPLPs) have been proposed for promising candidates of the advanced packages for multifunctional LSI with many I/O (input/output). FOPLP is expected to reduce the cost of FOWLP by improving the productivity per substrate. Dielectric materials for redistribution layers (RDLs) are one of the most important materials for FOPLPs....
Solder joint crack is increasing with increasing of warpage caused by larger Wafer Level Chip Size Package (WLCSP). Bump Support Film (BSF) were proposed as a protect material for preventing a solder joint crack of bumps. The BSF was constructed of a back grind tape and Bump Support Layer (BSL) which was composed of thermosetting epoxy resin. One of the key points of forming the BSL on a wafer which...
High thermal conductive adhesive is important to cool power devices. Recently thermal conductivity reaches more than 10W/mK by efficient addition of thermal conductive filler. However, high loading of filler makes the thermal conductive sheet poor adhesion. Furthermore, we focused on reducing an interfacial heat resistance between high thermal conductive sheet composed of resin and heat conductive...
This paper describes a thermal design method of printing process in printers that a lot of electrical components are mounted and the structure in the inside becomes complex because miniaturization and more additional functions are strongly demanded. Most of printing methods such as a laser printing and a thermal printing use heat in order to do the printing. In order to increase a reliability of the...
Thermal dissipation phenomena have to be considered from various viewpoints of basic functions such as phonon drift, photon emission, mass transfer and potential transfer. At present, the phonon transfer and mass transfer issues are mainly simulated and analyzed, but they are not enough for the total analysis of thermal dissipation phenomena. Paul D. Franzon, North Carolina State Univ., often says...
In this paper, The relationship between the temperature rise of the heat generating components densely mounted in a grid pattern on the board and the various board design conditions was discussed. Based on the discussion, a simple estimation formula that can be used for temperature estimation for densely mounted components was derived.
SiC devices are expected to be used in high voltage fields that require a breakdown voltage from 3 to 10kV such as railways, as well as the automotive that require high reliability such as hybrid vehicles and electric vehicles. This paper presents the packaging technologies of enhanced breakdown voltage for All-SiC modules.
A dual-band millimeter-wave (mmW) dielectric resonator antenna (DRA) in silicon based integrated passive device (IPD) technology for unlicensed V-band (57–64 GHz) and E-band (71–86 GHz) applications is proposed in this paper. In the proposed structure, dielectric resonator (DR) was fed by using vertical coupling feed architecture to improve the antenna efficiency and gains. The simulated results show...
On the transmission line, connectors cause signal integrity, or SI reduction because their parasitic inductances bring on characteristic impedance mismatching. Particularly, the connectors used in high-speed bus systems, such as PCI-express, USB, and SATA in GHz domain cause serious SI degradation, resulting in mal-operation in the systems. The transmission systems on printed circuit boards (PCBs)...
Recently, the importance of the optical fiber is increasing particularly in sensing application. Thus, this paper proposes optical sensing by exposed core fiber technology using Self-Written Waveguide (SWW) method. SWW method is fabrication of an optical channel waveguide using a UV-curable resin. As a UV light irradiated, A SWW with length of 800 micrometers is aligned between two fibers from the...
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