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This work proposes a broadband microstrip patch antenna array with H-shaped aperture-coupled stacked rectangular patches is implemented to low-cost and low-loss organic substrate for flip chip chip scale (FCCSP) package for millimeter-wave antenna in package (AiP) application. The proposed antenna array is built on a low-cost and low-loss multilayer organic substrate for flip chip chip scale (FCCSP)...
This work proposes a Yagi-Uda array with fan-like driver for millimeter-wave application. The proposed antenna array is built on a low-cost and low-loss multilayer organic substrate for flip chip ball grid array (FCBGA) package. The package size is 16 × 8 × 0.44 mm3. The proposed four-element antenna array results in a peak gain of 12 – 14.5 dBi at operating frequency band. The proposed antenna achieves...
In the mobile phone market-driven trend, mobile phones are equipped with high definition display, low power consumption, and a thin and light body. As mobile phone body thickness keeps decreasing, many components should follow the trend, including display panel module, covering panel glass, phone case, battery, camera module, PCB, IC package…etc. In this paper, the fan-out wafer level package (FOWLP)...
This work proposes a Yagi-Uda array with fan-like driver for millimeter-wave application. The proposed antenna array is built on a low-cost and low-loss multilayer organic substrate for flip chip ball grid array (FCBGA) package. The package size is 16 × 8 × 0.44 mm3. The proposed four-element antenna array results in a peak gain of 12 – 14.5 dBi at operating frequency band. The proposed antenna achieves...
A high-directivity microstrip-fed Yagi-Uda antenna has been developed for millimeter-wave applications. This work proposed antenna is built on a low-cost and low-loss multilayer organic substrate for flip chip ball grid array (FCBGA) package. The proposed antenna achieves both broadband and high gain characteristics, which meets the requirement of IEEE 802.1 lad standard. The four-element Yagi-Uda...
A high efficient CMOS class-E power amplifier (PA) by using Quad Flat No-leads (QFN) package combined with Through Silicon Via (TSV) grounding is presented. TSV has much smaller parasitic inductance and resistance than wire-bonds. TSV technology can improve PA efficiency, reduce die size samples and retain low cost in QFN package. The TSV samples are made and measured by using double-side probing...
The effect of the conductor surface roughness for high-speed signal transmission on package substrate is analyzed. When skin depth becomes smaller than surface roughness at high frequency, the loss of surface roughness becomes important. In this paper, the transmission line patterns are designed on substrate of different conductor surface treatment processes for measuring and comparing the performance...
This paper presents the electrical characterization of fine line design. For this kind of very thin and narrow fine lines in high density substrate, the trace is no longer lossless or low-loss transmission line and the characteristic impedance is also varying with frequency. This phenomenon on high density substrate will lead to different design guideline from conventional one. In this paper, the...
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