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Presents the introductory welcome message from the conference proceedings. May include the conference officers' congratulations to all involved with the conference event and publication of the proceedings record.
This paper describes an EM (electromigration) mechanism on interconnected Cu pillar in flip chip package. It will be clarified that the EM life depends on Cu pillar interconnection structure. Recently, it was reported that the EM life was deteriorated by applying ENEPIG (electroless Ni-P/Pd/Au) plating layers on a substrate pad used for solder connection [1]. It was because Ni diffusion into solder...
Downsizing the Cu signal traces in the redistribution layer is an effective approach to increasing the number of signal I/O lines and thereby greatly increasing signal processing performance between logic and memory chips in advanced fine-pitch packaging. Downsized Cu traces, however, are vulnerable to current stress, which degrades electromigration resistance. This is a serious problem in advanced...
Increasing I/O counts have led to ever decreasing cross sectional contact areas or, by default, an increase in solder performance expectations. A recognized measure of solder joint integrity is gained through High Speed Shear testing, (HSS). This article will statistically evaluate the solderability of the dominant final finishes with reference to some real life variables. The only skew is that only...
We present a new bidirectional optical subassembly (BOSA) packaging method which utilizes silicon optics and mechanics to integrate a lens, a DFB laser, a monitor photodiode (MPD) and a wavelength division multiplexing (WDM) filter into a silicon submount. The technology enables a compact packaging form within in a single trasnsistor outline can (TO-can) for BOSA. We made most of the assembly process...
A 25.78-Gbit/s × 4-ch active optical cable (AOC) with a ultra-compact form factor is proposed. The size of the proposed AOC is 5.2 cm3, which is 45-% smaller than the standard form factor of a pQSFP. By utilizing a gapped ground electrode structure, the proposed AOC demonstrated 25.78-Gbit/s error-free optical transmission under all-channels (4-ch) operation, and improved bit error rate (BER) power...
We demonstrate a 28-Gb/s × 24-channel on-board optical transceiver operated under an air-cooling environment. The optical transceiver realizes a data rate density as high as 1.34 Tb/s/inch2 with a total power consumption of 9.1 W. A unique packaging structure of the transceiver enables using the whole top surface for thermal dissipation by the aid of air-cooling heatsink. The optical module realizes...
This paper proposes a fully integrated 5–12 GHz power mixer in tsmcTM 1P6M 0.18 μm CMOS technology. The power mixer is used to replace the conventional mixer and power amplifier (PA). The circuit consists of an up-conversion Gilbertcell mixer and a wideband and low loss 1:4 Guanella-type differential transmission-line-transformer (DTLT). The power mixer is biased at deep class A/B under a 3.5-V supply...
A fully integrated 24.5/35-GHz dual-band T/R/Calibration switch module with Q-enhanced filtering function for a concurrent dual-band phased array system is presented. The proposed T/R/Calibration switch module offers internal calibration function with a quasi-elliptic dual-bandpass filtering which is enabled by a Q-enhanced metamaterial transmission line structure. This switch module architecture...
A switchable tunable dual-band filter using varator diodes for band switching and frequency tuning is proposed. The tuning range of first band is from 2.3 to 2.8 GHz and second one is from 1.8 to 2.1 GHz. The proposed dual-band filter is composed of two second-order Chebyshev short-ended hairpin comb filters which embedded a pair of the varators as a switching and tuning elements. The simulated and...
The small-cell base station requires a high linearity, high reliable and high efficiency power amplifier to enhance signal strength in a coverage region. To meet the demand, the 2.6 GHz two-way symmetrical Doherty power amplifier module which uses modularized components, enhances system stability and integrates with heat sink is proposed. The experimental results show that the proposed module delivers...
The fact that Sn-Cu reaction rate is much faster than Sn-Ni reaction and releasing much more gibbs free energy causing Sn prefers to have reaction with Cu instead of Ni. Moreover, at the temperature below 170°C, Sn side-wall reaction rate is larger than IMC formation rate at the temperature below 200 °C because the long distance Sn side-wall migration is faster than Cu traveling through to center...
The semiconductor packaging technology trend for electronic products continues to achieve greater miniaturization and higher functionality. Thinner profile chip scale packaging (CSP), such as flip chip CSP (fcCSP), with increasing die complexities is a very important technology for next generation communication devices and internet of things (IoT) applications. Recently, integrated fan out wafer-level...
This paper reports optical fibers for low-loss coupling with silicon photonic circuits. We fabricate both singlemode fibers and polarization-maintaining fibers with a mode field diameter of 4 pm for matching with an edge coupler. We demonstrate fusion splicing with standard transmission fibers and optical coupling with silicon photonic devices. Low-loss splicing is achieved by utilizing the thermally...
We have designed, fabricated and tested edge couplers for silicon photonics targeting industry-standard SMF-28 fibers. These edge couplers are based on a SiN inverse taper fabricated on a silicon-on-insulator (SOI) platform combined with an etch-based substrate removal process that prevents leakage of the expanded mode to the underlying silicon substrate. The measured couplers exhibited a 0.5 dB bandwidth...
As line rates in data centers increase to 25 Gb/s and higher, system architects are seeking solutions to overcome signal integrity issues due to the long electrical traces that require retiming. In addition, the density of interconnects on the front panel is limited by the size and power dissipation requirements of the pluggable modules. One proposal to alleviate these issues is to use embedded optical...
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