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In this study, we demonstrate the use of the extended spectrum of the short-wave infrared DBX Emission System to detect thermal emission with a high enough resolution to perform physical failure analysis. The case study was performed on a 16nm technology System On Chip (SOC) memory access circuitry. Multiple optical filters were used in the analysis in order to isolate the few emission spots that...
In this paper, the gated imaging technique of dynamic photon emission is realized and introduced as a powerful localization tool by using a low-cost near-infrared InGaAs image intensifier (I.I). At first, the setup and the method for gated imaging of photon emission microscope (GI-PEM) are presented. As one of global localization tools, it shows an unique and economical debugging and pinpointing capabilities...
Photon Emission Microscopy is the most widely used mainstream defect isolation technique in failure analysis labs. It is easy to perform and has a fast turnaround time for results. However, interpreting a photon emission micrograph to postulate the suspected defect site accurately is challenging when there are multiple abnormal hotspots and driving nets involved. This is commonly encountered in dynamic...
Today's complex integrated circuits demand tight process control in manufacturing. In this paper, several case studies due to slight process deviation resulting in yield loss from marginal leakage failure were presented. While conventional fault isolation approach relies on the localization of exclusive laser induced or photon emission hotspot to highlight the defect location and pays little attention...
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