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The three-dimensional (3-D) NAND flash memory technology has been considered as a promising candidate for future memory solutions, because it overcomes the scaling limitation and reliability issues faced by conventional planar memory. Even though 3-D NAND flash memory structures have many merits, self-heating effect is aggravated seriously due to the poor thermal conductivity of some of the materials...
In this work, the high temperature (up to 375°C) dynamic characteristics of 1.2kV SiC VDMOS, including the gate charge, the switching and the body diode reverse recovery characteristics, are measured and analyzed in detail. The experiments show that, with the increase of temperature, the Miller plateau declines, the reverse recovery charge rises, the turn-on time decreases and the turn-off time increases...
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