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In this study, we demonstrate the use of the extended spectrum of the short-wave infrared DBX Emission System to detect thermal emission with a high enough resolution to perform physical failure analysis. The case study was performed on a 16nm technology System On Chip (SOC) memory access circuitry. Multiple optical filters were used in the analysis in order to isolate the few emission spots that...
Software scan diagnosis has been the de facto approach to narrow down possible defect locations in logic circuits by virtue of its speed and effectiveness. However, this capability is not supported for all product yield engineering and custom electrical failure analysis is naturally relied on. By this approach, unless the defects are gross, fault localization of internal logical nodes can be challenging...
This paper describes the use of Electrical Optical Frequency Mapping (EOFM) in amplitude and phase mode to binary search the broken scan cell and missing clock activities in scan-chain failure for Application-Specific Integrated Circuit (ASIC) die inside the sensor device. Due to the smaller size of the ASIC die at the bottom stack of the GCELL and the Evaluation Board (EVB) design which not favorable...
To realize higher spatial resolution than conventional SEM-based nano-probing system, a novel Electron Beam Absorbed Current imaging system was newly developed using a Hitachi HD-2700 200 kV dedicated STEM. Its specimen holder accommodates a mechanical probe for current detection and TEM grid specimen. This holder also has a micrometer-based coarse positioning and piezoelectric-elements-based fine...
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