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The large difference between TLP (Transmission Line Pulse) and HBM (Human Body Model) test results of a power NMOS have been analysed using experimental tests as well as physical FA (Failure Analysis). A phenomenological explanation has been provided to account for the negative (positive) voltage surge that occurs during HBM positive (negative) zap on drain due to inductance of the bonding wire. Finally,...
This paper demonstrates integration non-destructive analysis tools solution of MEMS multi-bonding to inspect the fusion bonding interface and eutectic bonding interface to locate defect layers. This analytical study shows successful SAT (Scanning Acoustic Tomography) and IROM (Infrared Optical microscopy) inspection of MEMS multi-bonding single issue layer. The multi-bonding double layers were happened...
Silver alloy wires with the advantage of low cost, good thermal conductivity and electrical conductivity have been adopted in packaging industry [1, 2]. For plastic encapsulated microelectronics (PEMs) conventional wet decapsulation method is widely used and is implemented by using individual acid or mix acid. However silver alloy dissolves easily in acid. In this study, we present an automatic decapping...
In the analysis of plastic packaging SiP product failure, we should not only consider the plastic material and techniques inherent problems, but also the problem that SiP products have a lot of materials, complex structure, and small surface bonding. A type of plastic packaging SiP module function failure after reflow soldering, through appearance inspection, pin electrical characteristic test, X-ray...
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