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This paper brings a comparison of the traps identified in triple-gate FinFETS and Gate-All-Around (GAA) nanowire (NW) MOSFETs built with the same technological process. Traps have been identified using low frequency noise (LFN) spectroscopy, giving information on which process steps may be improved in order to build better devices.
New process conditions involving temperature below 900°C, and then compatible with SOI wafers and CMOS technologies, were successfully developed in order to realize atomic flat interface in MOSFETs. The implementation of these processes did not only reduce the variability of electrical performances but also brought the low frequency noise level down, making MOSFETs fabricated on atomically flat surfaces...
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