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Ever increasing power, efficiency and robustness requirements of electronic systems demand rising degree of co-operation between development partners. An obvious example is the e-mobility boom. It is essential to keep an eye on the complete chain of interactions from power electronics via magnetic to thermal, vibration, even acoustical domains during the complete development process from initial draft...
FDM is one of the popular 3D printing technologies due to an inexpensive extrusion machine and multi-material printing. However, FDM could only use thermoplastics such as ABS and PLA and has a problem related to the post-processing. In this study, we measured the mechanical property of ABS parts fabricated by FDM and the vapor smoothing technique which is one of the post-processing methods. Using...
Interlayer dielectric (ILD) fracture was investigated to better understand and mitigate failures in the interconnect systems of wafer back-end-of-line (BEOL) stacks. Variation in strength can cause fracture or delamination flaws resulting in reliability issues in the final product due to chip-package interactions (CPI). This study developed means to identify potential strength weaknesses induced during...
3D-Printing technology, or additive manufacturing, is seeing increased interest in the electronic packaging community as it has the potential to enable cost-effective, potentially high-throughput and high degree of design customisation. At the same time there are a number of challenges related to quality, performance and reliability of the fabricated products. Technological advances and other capabilities...
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