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This paper presents results of flex cracking experiments on Multilayer Ceramic Capacitors (MLCCs). The influence of solder fillet height, solder type and MLCC dimensions on the crack susceptibility of the component has been investigated. Subsequent statistical and metallographic analyses were carried out for more understanding of the failure mechanism. The statistical results show that the solder...
The aim of the study is to carrying out a series of experimental reliability tests for lead solder alloy Sn63Pb37 regarding to the so-called model of damage accumulation. In spite of Sn63Pb37 is prohibited in mostly cases by RoHS directive it is still used in lots of electronic devices which have influence on human life safety e.g. life-support machines, airplanes etc. That's why authors decided to...
This paper reports recent progress in modeling and simulation of a one-dimensional Micro-Mirror Array actuated by an electrostatic force. We present results obtained through numerical simulations of a single cell: the analysis and the optimization of the pull-in voltage and the analysis of the bounces of the mirror in contact with the base when it is subjected to a voltage exceeding the pull-in voltage...
In this work, we infer the influence of pre-stress in the design of a capacitive force/pressure sensor. For this purpose, experimental plans, so-called Designs of Experiments (DoEs), are employed. Based on these designs, not only the influence of design parameters can be inferred, but also a prediction model, which uses the design parameters as predictors, can be determined. Rapid prototyping technologies,...
This paper is focused on the thermally-induced thermo-mechanical load in interconnections of electronic products, which are necessary to connect an electronic component on substrate material (such as Printed Circuit Board). In order to improve of the material selection, the Fraunhofer IKTS has developed a measurement setup enabling a cost-efficient material characterization in terms of mechanical...
Although the area of flexible circuits is not new, current display and portable electronics consumer markets are driving device and packaging designs that will require increasingly higher robustness, especially as more devices are driven toward lightweight, wearable designs that enhance the personal IOT (Internet of Things) association. There will be an advantage for developers in flexible electronics...
Modeling the electric field in a matrix of micro-mirrors is presented as the first application of the MEMSALab software package. The latter is dedicated to semi-automated derivation of multiscale models by asymptotic methods and will complement simulation software as finite element software. It is designed according to a principle of reusability which is called the extension-combination method developed...
Power electronic applications come along with very high requirements in terms of reliability. Thermal loadings stress whole electronic packages while powering the semiconductor and by environmental temperature changes. Direct copper bonding (DCB) substrates are widely used in electronic applications due to its high thermal conductivity performance. They consists of copper layers sintered onto an Al...
In the past, a large number of material models for Sn-based solder alloys have been proposed, which are usually calibrated based on the material testing under isothermal the conditions. However, their ability to map the lifetime differences depending on the temperature rate under the field and test-lab conditions, as well as on the mean operating temperature, is still not completely investigated and...
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