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Because of its localized impact on the band structure, non-uniform strain at the heterojunction between lattice-mismatched materials has the potential to significantly enlarge the design space for tunnel-field effect transistors (TFET). However, the impact of a complex strain profile on TFET performance is difficult to predict. We have therefore developed a 2D quantum mechanical transport formalism...
A new approach for including quasi-ballistic effects into TCAD drift diffusion simulations of short-channel III–V MOSFETs at low longitudinal fields is presented. The model is based on the concept of ballistic mobility through a modified Matthiessen rule. It has been applied to double-gate thin-body InGaAs MOSFETs and benchmarked against multi-subband Monte Carlo simulations. Our results indicate...
In its standard formulation the drift-diffusion (DD) model frame cannot describe the influence of the ballistic resistance on the device characteristics. This results in considerable problems in calibrating the short channel behavior of advanced devices. In this paper, we propose a new formulation for the inclusion of the ballistic resistance into the DD model frame consisting in adding a simple ballistic...
Drain current in Ultra-Thin Body (UTBB) Fully-Depleted Silicon-On-Insulator (FDSOI) device is investigated using Non-Equilibrium Green Function (NEGF) simulations. The effects of phonons (PH) and surface roughness (SR) on saturation velocity are studied. We analyze the current and extract quantities relevant to Quantum Drift-Diffusion (QDD) solvers, such as the quasi-Fermi level, the quantum potential...
We extend our drift-diffusion based model for the carrier energy distribution function (DF), which was derived to describe hot-carrier degradation in LDMOS transistors, for the case of decananometer nMOSFETs with a gate length of 65 nm. This approach is based on an analytical expression for the DF with parameters obtained from the drift-diffusion model. To approximately consider the important effect...
SCM application gives ReRAM opportunity to become mainstream technology, beyond embedded field. Memory reliability improvement and memory/selector co-optimization are still required. To offer better performance/cost trade-off and differentiate from other technologies are necessary for ReRAM to step forward.
Resistive switching memories have been identified as an enabling technology for a variety of emerging computing applications, including neuromorphic and logic-in-memory computing. For example, analog tuning of the memory state combined with high integration density of memristors is needed for very compact implementation of synapses, the most numerous devices in artificial neural networks and would...
We assess the impact of the conductance response of Non-Volatile Memory (NVM) devices employed as the synaptic weight element for on-chip acceleration of the training of large-scale artificial neural networks (ANN). We briefly review our previous work towards achieving competitive performance (classification accuracies) for such ANN with both Phase-Change Memory (PCM) [1], [2] and non-filamentary...
Currently available sensor systems relying on multi-cantilever deflection detection by optical means are generally limited in their functionality by complexity and cost. Several laser sources as well as big sized detectors are needed to record the signal from each cantilever separately. In the frame of the ENIAC Joint Undertaking project Lab4MEMS II our group is currently developing a novel device...
Micro/nano-electromechanical resonator based mechanical computing has recently attracted significant attention. However, its full realization has been hindered by the difficulty in realizing complex combinational logics, in which the logic function is constructed by cascading multiple smaller logic blocks. In this work we report an alternative approach for implementation of digital logic core elements,...
This work presents one of the first low power pH sensing microfluidic chip based on the heterogeneous integration of: (i) high-k FinFET sensors with liquid gate, (ii) miniaturized Ag/AgCl quasi-Reference Electrode and (iii) passive microfluidic. The integration of these three components provides a fully integrated and compact platform that could be exploited for ionic monitoring in biofluids for healthcare...
This paper introduces a two-dimensional physics-based compact model for a double-gate (DG) Tunnel-FET (TFET) implemented in Verilog-A. The compact model is derived from an analytical model published in [1], [2], [3]. TCAD Sentaurus simulation data as well as measurement data are used to verify and show the flexibility of the modeling approach. Advantages and limitations of the compact model are analyzed...
In this work we present a large signal non quasi static (LSNQS) compact model based on the discretization of the current continuity equation using a spline collocation approach. The underlying charge/current model is based on the VRH theory. The LSNQS model takes in consideration the presence of parasitic regions and is particularly suited for simulations of printed organic thin film transistors....
Variability of low frequency noise (LFN) in MOSFETs is both geometry- and bias-dependent. RTS noise prevails in smaller devices where noise deviation is mostly area-dominated. As device dimensions increase, operating conditions determine noise variability maximizing it in weak inversion and increasing it with drain voltage. This dependence is shown to be directly related with fundamental carrier number...
In this paper we present an advanced methodology for effective 3-D device electrothermal simulation of power structures and power integrated circuits. The proposed electrothermal simulation is based on direct interconnection of a 3-D FEM thermal model and electrical circuit model of the device using a mixed-mode setup supported in Synopsys TCAD Sentaurus environment. This approach combines the speed...
While silicon carbide (SiC) is now believed to be a potential replacement to leading horse material silicon (Si) on many power fronts, this paper addresses the merit of SiC material for a diverse range of power applications. Several commercial SiC power modules have been characterized and evaluated under various test conditions and hence strengthening the confidence level of their usage in the field...
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