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This talk will introduce the Micron Automata Processor, a novel computing architecture that permits massively parallel execution of multiple non-deterministic finite automata. The Automata Processor inspires a new programming paradigm of solving problems using complex pattern matching engines executed over streaming data. The first part of this talk will focus on the processor characteristics, programming...
CMOS technology ushered in the silicon VLSI era over thirty years ago. This talk reviews the history of CMOS devices and projects their future prospects. For any given technology node, CMOS performance is limited by the shortest channel length that can be made while maintaining the integrity of transistor action. The development of the MOSFET scale length theory will be tracked from the 1970s to the...
Modern medicine has the potential of becoming both more personalized-and low cost-thanks to recent discoveries at the intersection of molecular biology, chemistry, and engineering physics. I will speak about using optical controls of our individual gene circuits in living cells for the treatment of cancer, infectious diseases and neurological diseases. I will also describe an integrated molecular...
As the CMOS technology approaches the fundamental scaling limits and the functional integration of multiple components (e.g., NEMS, biosensors, ferroelectric/polymer capacitors, etc.) onto the CMOS fabric suggests remarkable potential for More-than-Moore technologies, the landscape of reliability considerations are evolving rapidly for the semiconductor industry. In this tutorial talk, I will discuss...
3D chip stacking refers to a vertical stack of chips in which individual chips can communicate with each other through electrical connections. 3D chip stacking has the ability to enhance chip performance by increasing bandwidth, reducing wire delay, and enabling better power management. In true 3D chip stacking, all chips except possibly the topmost chip, contain TSVs (Through Substrate/Silicon Vias)...
The 2000 Warner Brothers blockbuster movie “The Perfect Storm” depicted how a confluence of weather conditions in October 1991 combined to produce an epic killer storm in the North Atlantic. Caught in the storm was the swordfishing boat Andrea Gail. The boat and crew did not survive. Fast forwarding to 2014, the memory industry appears to be facing a perfect storm of its own. While survival of the...
This tutorial begins with an examination of noise models of devices and then considers the noise of representative blocks such as amplifiers, mixers and oscillators. The presentation will highlight the different consequences of stationary and cyclostationary noise processes. Throughout the emphasis will be on the acquisition of useful design insight. Many of these insights prove to be broadly useful...
Power supply induced clock jitter accumulation is a function of several variables including the power supply rejection characteristics of circuits in the signal path, signal path electrical length, signaling frequency, and voltage supply noise magnitude and frequency. Brute force, closed-loop, transistor-level modeling and simulation of clock timing in the presence of an extracted power delivery network...
Mobile computing has become the mainstay and the fast-growing segments of semiconductor industry over the last few years. Moreover, globally today there are 10 billion devices connected to the internet and in 2020 this number is projected to increase five-fold to 50 billion. Ubiquitous mobile computing is the next frontier and driver for continued growth of semiconductor industry. Ubiquitous mobile...
In this paper, we demonstrate that high voltage NMOS is very sensitive to LDD implant process conditions. With the same implant energy and dose, high voltage NMOS channel punch through BVDSS tail is strongly toggled by critical implant process parameters such as beam current and beam size. Lower beam current density reduces both implant damage and beam angular divergence. As a result, LDD lateral...
Flexible electronic systems have been limited by the ability to integrate IC functionality. Traditional silicon-based ICs are not flexible, and flexible transistors are too large and too slow to approach silicon-based IC density and performance. Transferring standard silicon IC wafers to polymer substrates addresses these limitations by transforming traditional ICs into a physically flexible form...
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