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Gold wires are commonly used for wire-bonding and it fits well the industrial requirements. However, the price of Gold wires increasing significantly, Copper wires is a potential replacement for Gold due to their superior electrical and mechanical properties. In order to incorporate Cu in the wire-bonding process, substantial data regarding aging and intermetallic formation of Cu-Al bonds is required...
A 2nd level electronic package was fabricated using a die, polymer based epoxy and gold wire bonds. This package was subjected to reliability testing to gauge its reliability under extreme operating conditions, with the temperature raised to a constant 85°C, and 85% humidity for 300–400 hours to simulate transport conditions and operation in consumer electronics. The reliability is determined via...
Nowadays, increasing of gold price and decreasing of dielectric let copper and low-k dielectric materials become a new technology and are increasingly chosen as preferred interconnect insulated material in semiconductor applications. In this paper, a C45 ultra low k wafer technology with bond-over-active bond pads, on a thermally enhanced BGA package with 31×31mm large body size is selected to study...
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