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The electrical performances of nano-interconnects are affected by temperature and size, which may seriously limit the current density and the reliability. This paper introduces such effects in the modelling of the electrical resistance of nano-interconnects, either made by copper and carbon-nanotubes. A simple and accurate semi-analytical model is proposed to describe the impact of size and temperature...
This paper proposes a closed-form empirical equation to account for the eddy-current loss due to metal fill. For a given average magnetic field the formula estimates the loss due to in-plane fills. The formula was developed over a wide range of dimensions and frequencies up to 50 GHz, and was found to be accurate to within 8% over this range. We also verify the formula using an example microstrip.
The manufacturing of interconnects often leads to conductors with a non-rectangular cross-section. Especially for sharp edges, it is therefore important to study the influence of corner effects on the interconnect circuit characteristics. Firstly, the electromagnetic behavior of a finite conducting 2-D wedge is investigated. Secondly, as an application example, a broadband transmission line model...
For high speed signaling, 100Ohm differential impedance has been commonly used for decades. In recent years, 85Ohm differential impedance has been adopted for PCIE Gen2 and Gen3 for better signal integrity performance and routing consideration. However, for storage IOs such as SATA and SAS, buffer, cable, and connector, etc, are 100Ohm design. It is not clear whether we still have better signal integrity...
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