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The following topics are dealt with: Baltic electronics conference; Thomas Johann Seebeck; SoC design; wireless communications; networked embedded devices; computer system design; power electronics systems; electronics materials, technologies, devices, and simulation; integrated electronics and chip design; fault tolerance; dependable computing and formal verification; systems, instrumentation and...
This book and CD contain the papers presented at the 12th Baltic Electronics Conference (BEC2010), which was held in Tallinn, Estonia in 4–6. October 2010. This time the opening plenary session was held at the Tallinn University of Technology and the conference sessions and the final plenary session at the conference centre Swissotel Tallinn. The Department of Electronics together with the Department...
The history of the Baltic Electronics Conference BEC series is presented. What kind of hindrances and hurdles the idea brought to the organizers and how we reached the level, where we are today. Some futuristic visions are presented as well.
Thomas Johann Seebeck, Estonian-German physicist, chemist and physician was born in 1770 in Reval, now Tallinn, Estonia. Educated in Tallinn, Berlin and Göttingen, he lived and worked in Jena, Bayreuth, Nuremberg, and Berlin, where he died in 1831. In this article, his life and his main scientific achievements are briefly overviewed.
The paper emphasizes methods, architectures and components for system-on-chip design. It describes the basic knowledge and skills for designing high-performance low-power embedded devices whose complexity increases exponentially, as so does the effort of designing them. Relying upon an appropriate design methodology which concentrates on reuse, executable specifications, and early error detection,...
The paper integrates the results of the previous work and presents the complete methodology for synthesis of digital circuits and systems from hierarchical and parallel specifications expressed in the form of hierarchical graph-schemes. Such specifications provide support for design reuse, parallelization and other important features highlighted in the paper. The synthesis is based on the model of...
The specifications of power electronic systems are becoming ever more exigent - better performance (dynamic and steady state), increased efficiency, reliability, and quality, and decreased power rating, size (volume and weight), and cost. One strategy for the overall improvement of these systems is to use various cooperating converters with the system functions being shared among them, optimizing...
Though the principle of reciprocity was invented by Hermann von Helmholtz already over 150 years ago, and though it is a very powerful tool in solving various important problems in bioelectromagnetism, it is not generally used. In impedance tomography the measurement sensitivity distribution has generally been misunderstood. This can be easily demonstrated with the principle of reciprocity. Some other...
This paper presents the comparative study of different current carrying structures used to produce electromagnetic field in magnetic based micro-pumps. The operation of the micropump lies on magnetic field that concentrates microbeads in the fluid channel and moves this cluster of microbeads in each direction forcing the fluid to flow in that direction. In this paper Finite Element simulation results...
Microfluidic lab-on-chips are miniaturized biosensors that integrate fluidic, electronics, thermal elements or optical apparatuses for analysing electrolytic or biochemical samples. Supplementary to their analysing capabilities, the microfluidic lab-on-chips can process, control, separate or sort fluidic samples by means of hydrodynamic manipulation, thermal gradients, electrical or optical actuation...
We report the hydrogen sensing properties of a sensor using TiO2 nanotube arrays. The TiO2 nanotube arrays were fabricated by anodization on titanium foil, in an electrolyte containing 0.5 wt% hydrofluoric acid mixed with water, the electric potential being 15V. TiO2 nanotube arrays were annealed at 600 Celsius for 1 h. The sensors were equipped with platinum electrodes. These two were connected with...
MOS transistor structures are widely used in modern integrated circuits (IC). Different manufacturing methods are used. Many problems, such as the length, width of the channel, the overlap of source and drain areas with gate area, the diffusion of impurities after HTTO (high temperature technological operations). The solutions for all these problems are based on the mode of manufacturing processes...
The comparison of JBS chips and JBS stacks connected in series by diffusion welding DW has been made using deep level spectroscopy (DLTS). As it was expected, JBS stacks are characterized by higher volumes of reverse voltage (Ur), higher series resistance (Rs) and, therefore, higher forward voltage (Uf). In the stacks two times reducing of capacitance has been fixed. Diffusion welding (DW) technique...
The paper gives short overview of SiC based complementary multi guard ring JSB structures and the numerical model to be used in the analysis. The static U-I characteristics are under investigation. The geometry and temperature influence has been analyzed.
The paper gives short overview of an efficient CMOS technology based current source realization and layout design. The current source output will be shortened square wave signal [1],[2] and [3]. The output current value can be selected from range 5 to 100μA. The current source layout design needs good matching, the geometry and temperature influence has been analyzed and the optimal geometrical structure...
In this paper, the most critical reference voltage generation issues in high-speed (several hundreds of MSamples/s) pipelined Analog-to-Digital Converters (ADC) are discussed. Due to inductance of the bonding wires, large on-chip filtering capacitors are needed for stable references, when the generation is done off-chip. Through the simulations it is illustrated how the bonding wire inductances and...
The design of CMOS bandgap voltage references focusing on high accuracy and low temperature coefficient methodologies is discussed in this paper. Several solutions of total bandgap voltage reference error minimization are considered. As a summary it is proposed bandgap voltage reference with output voltage accuracy 1.2V ± 0.08% in temperature range -40...125°C.
The paper presents a new solution to achieve rail-to-rail common mode input voltage swing for CMOS operational amplifiers. The common mode input range of a MOS differential stage is limited by the threshold voltage of the input transistors. With a pair of complementary input stages the whole range from GND to VDD can be covered. Their drain currents are summed up but the resulting current as well...
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