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This paper provides an overview of metal source/drain (S/D) Schottky-barrier (SB) MOSFET technology. The technology offers several benefits for scaling CMOS, i.e., extremely low source/drain resistance, sharp junctions from S/D to channel and low temperature processing. A successful implementation of the technology needs to overcome new obstacles such as SB height engineering and precise control of...
Practical aspects of synthesis and applications of single-wall and multi-wall carbon nanotubes (SWNT and MWNT, respectively) are presented. Among numerous potential applications, utilization of nanotubes for interconnections in microelectronics and in gas sensors is considered in more detail. The issues related to compatibility of nanotubes synthesis and manipulation processes with the Si planar technology...
This paper shows that that H plays a role in the forming of oxide RRAM which is derived from studies of both the electrical and physical properties of the oxides. Going forward, there is a clear need for additional studies that combine careful physical and electrical characterization of oxide and sulfide RRAM devices, as electrical measurements alone are ambiguous. If a thorough understanding of the...
Scalable elements that can be switched between widely-separated non-volatile resistance states at very low power are desirable for applications in next generation memory and logic. One promising approach involves the use of solid ion-conducting films. A mobile metal ion-containing glassy electrolyte film sandwiched between an oxidizable metal layer and an inert electrode constitutes a device which...
The resistance switching characteristics of several metal oxides has been reported recently for nonvolatile memory applications (NVM). However, various issues such as the switching mechanisms, switching uniformity, scalability and reproducibility have not yet been solved. In this paper, we discuss the recent progress of switching mechanisms and switching behaviors of various materials.
We present recent studies on amorphous silicon (a-Si) based resistive switching nonvolatile memory devices. The devices exhibit excellent performance of high on/off resistance ratio, high yield, fast speed, long retention/endurance and are fully compatible with CMOS processing. High-density crossbar arrays were successfully demonstrated without degradation of the device performance as compared to...
To improve the performances of ohmic contacts for GaN devices, a novel multilayer Ti/Al-based metal scheme (Ti/Al/Ti/Al/Ti/Al/Ti/Al/Ni/Au) on undoped AlGaN/GaN heterostructures was employed. A contact with ??c (specific contact resistance) of 8.74E-07 ????cm2, Rc of 0.22 ????mm was demonstrated. Ohmic contacts with the novel metal structure were measured with I-V, SEM, HRTEM to show their properties...
Inductive effect becomes important for on-chip global interconnects, like Power/Ground (P/G) grid. Partial reluctance (the inverse of partial inductance) has been accepted to model inductive effect, for its local property. In this paper, a new method which makes full use of the structure regularity of P/G grid is proposed. With a reuse scheme and carefully handling of boundary effect, the proposed...
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