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The reliability of a stacked ball grid array (stacked BGA) package during the solder reflow process was examined using the finite element method (FEM). The stress intensity factors (SIFs) at an interfacial crack tip in the stacked BGA package were analyzed. Vapor pressure on the surfaces of an initial crack and thermal stress were considered. The vapor pressure during the solder reflow was estimated...
This paper demonstrates the experimental approach of using various packaging material combination and their effect on package stress at 260degC IR reflow condition. The study is extended into validating the results with the use of simulation and modeling tool using finite element analysis (FEA). Large leadless package (7.0 times 7.0 mm) was selected for this study. Samples were built with different...
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