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Flexible Circuit Boards (FPCs) are now being widely used in the electronic industries especially in the areas of electronic packages. Due to European lead-free legislation which has been implemented since July 2006, electronic packaging industries have to switch to use in the lead-free soldering technology. This change has posed a number of challenges in terms of development of lead-free solders and...
The purpose of this paper is to study the effect of plating thickness on fatigue failure of lead-free solder joints after thermal aging. Cyclic three-point bending tests were carried out and investigate the relationships between intermetallic compound (IMC) layer development and the fatigue life of solder joints. After the fatigue tests, cross- sections of solder joint were observed by scanning electron...
The reliability of a stacked ball grid array (stacked BGA) package during the solder reflow process was examined using the finite element method (FEM). The stress intensity factors (SIFs) at an interfacial crack tip in the stacked BGA package were analyzed. Vapor pressure on the surfaces of an initial crack and thermal stress were considered. The vapor pressure during the solder reflow was estimated...
In order to get better electrical performance and layout flexibility, adopting different profiles of solder bumps in flip chip packaging is inevitable. In this study, we mainly compare the effects of reflowed solder bumps coplanarity by altering their contours, magnitudes and volumes. By using Surface Evolver simulating software, we could further analyze and compare the differences in coplanarity...
The purpose of this study is to experimentally and numerically investigate thermal and residual deformations of plastic ball grid array (PBGA) package and assembly. In the experiments, a full-field shadow moire with a sensitivity of 29.2 mum/fringe is used for measuring their real-time out-of- plane deformations (warpages) during heating and cooling conditions. The elastic moduli (Es) and coefficients...
This paper presents the effect of package assembly processes and substrate features on flip chip ball grid array (FCBGA) package solder joint shock performance. The study covered only on lead-free solder system. The package assembly processes include the ball attach reflow temperature, oven environment setting, simulated burn-in, number of board reflow and substrate features such as solder resist...
This paper demonstrates the experimental approach of using various packaging material combination and their effect on package stress at 260degC IR reflow condition. The study is extended into validating the results with the use of simulation and modeling tool using finite element analysis (FEA). Large leadless package (7.0 times 7.0 mm) was selected for this study. Samples were built with different...
PoP technology is emerging as an alternative solution to SiP since it has advantage of easier testing and sourcing Flux-dipping PoP has risk of cold open joints due to package reflow warpage. Controlling warpage is challenging especially when top/bottom package come from different suppliers. New SMT paste STAMP was developed to enlarge process window of PoP stacking. The paste consists of higher m...
The article consists of a Powerpoint presentation on a analysis of SMT residues after reflow. The paper concludes that the residues can reduce the SIR, change normal appearances, make error report in ICT testing, decrease curing degree of under-fill and disturb the high frequency and high velocity signal; analyzing the solder paste pre-reflow and post-reflow by DSC, TGA, FTIR and GC/MS, the testing...
The article consists of a Powerpoint presentation on BGA solder joints' mechanical reliability in backside compatible soldering. The paper concludes that the solder joints' mechanical property in backside compatible soldering is as good as pure lead-free assembly; The failure location of solder joint in component shearing test is between solder pad and resin; The failure location in multi-time 4-points...
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