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This paper presents RF packaging issues involved in developing a reconfigurable RF tuner that provides a broadband impedance match to various antenna loads. The results show how changes in the architecture still achieve a high degree of tunability with low insertion loss
A systematic design procedure is derived to improve the electrical performance of multilayer through-hole via transition using high-impedance interconnects. In addition to thinner transmission line, a novel structure with ellipse-shaped anti-pad is proposed to achieve the better broadband matching condition. The compensation method also applies to a differential via transition successfully
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