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Multilayer (3D) integrated circuit technology (3D chip technology) provides an attractive alternative to conventional circuit scaling methods, which rely solely on continued shrinking of device dimension. Chip stacking, through the use of through silicon vias (TSVs) and micro ball grid arrays or copper pillars, allows increasing chip complexity in a node independent way. 3D chip technology also opens...
DRAM is a crucial component in computing systems, and is expected to be even more important as data-intensive applications become more prominent. A key challenge in advancing DRAM technology is the growing cost of refresh operations, which can impose a large impact on the energy efficiency of DRAM modules. Existing refresh mitigation techniques all require hardware modifications, which may be undesirable...
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