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Advantages and results of using a 3D EM simulator such as HFSS to design a compact integrated circuit (IC) are presented. Any electromagnetic (EM) fields' disturbances and interactions caused by the size and shapes of high frequency circuit elements have a significant effect on IC performance, die size and cost. Two SP4T four-throw PIN diode switches with different topologies are analyzed. The first...
An X-band Single-Chip monolithic microwave integrated circuit (MMIC) has been developed by using a European GaN HEMT technology. The very compact MMIC die occupying only an area of 3.0 mm × 3.0 mm, integrates a high power amplifier (HPA), a low-noise amplifier (LNA) and a robust asymmetrical absorptive/reflective SPDT switch. At the antenna RF pad in the frequency range from 8.6 to 11.2 GHz, nearly...
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