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In the paper, we develop and implement the processes of tape on-off and Ag mirror-reaction to the previously developed size scalable inkjet printing process technique, i.e. CPLoP (Combined Process of Lift-off and Printing) for continuing its future interconnect applications in flexible microelectronics. The newly developed processes not only reduce coffee ring effect but also improve better electrical...
The influence of current compliance (ICC) on resistive switching (RS) of silver programmable metallization cells (Ag-PMCs) with stacked SiOx/SiO2 solid electrolytes has been investigated by carrier transportation and capacitance-voltage measurements. The low ICC of 10 μA leads to the superior multilevel RS characteristics because of a locally discontinuous conductive filament within the stacked solid...
“Saturation Etching” is the method we have developed for decapsulating silver wire packages using a chemical solution. This method is also effective for copper wire packages, and damages to wires can be minimized by dissolving copper into acid.
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