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Using an advanced thin wafer technology, we have successfully fabricated the next generation 650V class IGBT with an improved SOA and maintaining the narrow distribution of the electrical characteristics for industrial applications. The applied techniques were the finer pattern transistor cell, the thin wafer process and the optimized back side doping concentration profiles. With the well organized...
Ultra-high voltage (>10 kV) power devices based on SiC are gaining significant attentions since Si power devices are typically at lower voltage levels. In this paper, a world record 22kV Silicon Carbide (SiC) p-type ETO thyristor is developed and reported as a promising candidate for ultra-high voltage applications. The device is based on a 2cm2 22kV p type gate turn off thyristor (p-GTO) structure...
The purpose of this paper is to introduce a dynamic electro-thermal simulation and analysis approach for device design and short-circuit safe-operating-area (SOA) characterization using a physics-based electro-thermal Saber®∗ model. Model parameter extraction, simulation, and validation results are given for several commercially available 4H-silicon carbide (SiC) power MOSFETs with a voltage rating...
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