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Most of the commonly used lead-free solders have a high melting temperature. However, in many applications a lower processing temperature would be beneficial. Therefore a demand has arisen for reliable lead-free solder with a lower melting temperature. Among the low temperature lead-free solders, Sn-9Zn and Sn-8Zn-3Bi (wt.%) are suitable candidates for many applications, since they offer good mechanical...
The effectiveness of the electronic parameter was evaluated in order to predict the mechanical properties of zinc system alloys for high temperature application. Firstly, the relation of ultimate tensile strength or elongation and s-orbital energy level (Δ Mk) of already reported Zn system multicomponent alloys were investigated. According to this relation, the lead-free Zn-Al-Sn system alloys have...
The main trends in consumer electronics are increasing product performances and costs reduction. These trends lead to an ongoing integration on package level which leads to a decreasing size of the solder contacts. This goes along with a higher sensibility to thermal-mechanical stress and the immanent void formation due to electromigration (EM) effects in interfaces and bulk materials like solder...
Packaging technology has to continuously evolve in order to keep pace with the demand for smaller and lighter products. One manifestation of this is the need to drastically reduce the size of flip-chip bumps and their pitch. To make things more challenging, the changes have to be mastered with new materials in response to lead-free legislation. At the same time the reliability of the electronic devices...
In this study, 0.5 wt.% CNTs-doped solder paste, that prepared by mechanical stirring, was used to detect the redistribution phenomenon of nanoparticles in the solder ball. Some of nanoparticles seriously separated out with the outward flow of solder flux, making related quantitative experiments loss their accuracy. Some of nanoparticles seriously gathered in the solder ball, having negative effects...
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