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This study describes fundamental melting phenomena of ring and cream solder and an evaluation of heat loss in laser soldering. Laser soldering is attractive from the viewpoint of minimum thermal impact on surrounding devices. However, detecting an appropriate laser irradiation condition is difficult since the heat loss is affected by several factors. Therefore, detecting an appropriate laser irradiation...
Hybrid bonding among Cu, Ti, quartz, and polydimethylsiloxane (PDMS) substrate, by using vacuum ultraviolet (VUV) irradiation and vapor-assisted surface modification processes, turned out highly feasible at 150 °C and atmospheric pressure. Such a hybrid bonding will be of practical use in the 3D integrations of flex transparent substrates and interconnection layers, which are often used in the optical...
We proposed a novel wafer level chip scale package in which Laser Lift Off (LLO) was adopted for substrate removal. We confirmed that the LLO did not cause both mechanical and thermal damages into GaN layer.
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