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We found that positive-tone photosensitive polyimide (posi-PSPI) shows not to be compatible for electroless Ni/Au plating process which are used for Au micro bumping. In order to meet compatibility for the process, we improved chemical resistance of positive-tone photosensitive polyimide especially for electroless plating process. Changing of polyimide polymer structure is most effective to obtain...
Ag-8Au-3Pd alloy wire has great potential of low-cost candidate for traditional gold wire interconnects. This study aims to light the behavior of degradation that took place in Ag-8Au-3Pd alloy wire bond interface. Two layers of intermetallic compound (IMC) at the Ag-8Au-3Pd/Al bond interface were observed by transmission electron microscopy (TEM). The specimens were annealed at 175°C in a closed...
The influence of diffusion on bonding micro-bumps at low temperatures in solid state was studied. The contamination was detected to act as a barrier layer on diffusion during bonding. The diffusion between Au and Sn occurred even at low temperatures by performing surface activation process before bonding and was effective on improving the bonding quality. The increase of bonding strengths of Au-to-Au...
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