The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Electromigration (EM) has become a key reliability concern for nanometer IC designs. For 3D ICs, higher current density/temperature and TSV-induced thermal mechanical stress further exacerbate the EM issue compared to 2D ICs. In this paper, we analyze the root causes of EM for 3D IC signal nets, with consideration of current density, temperature, and TSV-induced thermal mechanical stress. We develop...
Recent innovations in monolithic 3D technology enable much higher-density vertical connections than today's through-silicon-via (TSV)-based technology. In this paper, we investigate the benefits and challenges of monolithic 3D integration technology for ultra high-density logic designs. Based on our layout experiments, we compare important design metrics such as area, wirelength, timing, and power...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.