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Automotive electronics, solid-state-lighting, and solar cells need have to operate under harsh circumstances, either by the kind of environment they operate in, such as automotive electronics under the hood, or by the long durations of exposure. In both cases traditional lifetime assessment methods are failing: The accelaration factors, who are key to accelerated lifetime testing, are becoming to...
Interface delamination is one of the most important issues in the microelectronic packaging industry. Silver filled die attach is a typical adhesive used between the die and copper die pad for its improved heat dissipation capacity. Delamination between die attach and die pad will severely impact the heat conduction and result in product failure. In order to predict this delamination, interface properties...
The scope of the paper is to present the result of the determination of mechanical material properties of a SAC based solder at high strain rates. Miniature bulk specimens which have a diameter comparable to BGA joints are used to investigate the solder behaviour experimentally. Stress and strain data are recorded at high strain rates using a high resolution tensile test setup. Explicit FEM methodology...
Current developments and trends in microelectronics are focused on thin layers and novel materials. This leads to application of different test and measurement methods, which are capable to measure basic mechanical properties of such materials on micro-scale and nano-scale. This paper focuses on application of the nanoindentation technique. It is one of the most common method for investigating the...
Though being accepted and widely employed for decades, there remains no consensus in the industry on the selection of an optimum temperature profile for the accelerated temperature cycling (ATC) test for the evaluation of board level solder joint reliability. It is generally agreed that broader temperature range and higher mean temperature should result in shorter thermal fatigue life. Yet, people...
Many electronic products, particularly portable electronic products, experience during operation different loadings simultaneously. It has become clear that the single load tests do not represent well enough the use environments loading conditions of many electronic products and modifications to the reliability evaluation procedures are necessary. But before loading conditions can be combined in a...
The reliability of metallic microelectromechanical systems (MEMS) depends on time-dependent deformation such as creep. The interaction between microstructural length scales and dimensional length scales, so-called `size-effects', play a prominent role in this. As a first critical step towards studying these size effects in time-dependent deformation, a purely mechanical experimental methodology has...
Light Emitting Diodes (LED) are being implemented more and more into demanding applications like automotive and high-brightness general lighting. From the reliability point of view, the automotive environment is extremely harsh and challenging. Automotive electronics have to withstand exposure to high temperature fluctuations, mechanical shock impacts and vibration. The cyclic thermal load of solder...
Vibration is commonly encountered during the life time of electronic components. It is a major cause of failure due to cyclic strain and stress that give rise to damage in the materials making up the component. The recent move from lead to lead-free soldering by the electronics industry has necessitated the generation of material properties data that will allow accurate prediction of the lead-free...
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