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A simulation of the Board Level Drop-Test is performed to evaluate some WL-CSP (Wafer-Level Chip-Scale Packages) performances. An elastic-plastic model is applied on both solder bump and copper pad materials. It intends to demonstrate that copper plasticity is mandatory due to the large plastic strain occuring in these materials. A statistical analysis discusses the required accuracy for the modeling...
An increasing number of semiconductor companies have research programs related to MEMS resonators. This can be explained by the possible wide range of application areas. Many resonators operate in vacuum and sealing of the cavity can be obtained by using a Wafer Level Thin Film Package (WLTFP). To fit the MEMS-die into a small package it needs to be thinned. In this paper the effect of wafer thinning...
The main objective of this study is to validate the thermomechanical properties of materials used in some electronic components. The improved performance of HgCdTe infrared focal plane arrays requires reliability of the assembly at low temperatures down to 77K. Unfortunately, the thermomechanical behavior of most materials of these components remains to be clarified, particularly in a cryogenic environment...
In this paper, the state-of-the-art results of research and development in wafer-level packaging (WLP) is reviewed. The paper starts from the introduction of several fan-in wafer-level packaging technologies. The focus is given on the fan-in WLP reliability performance as related to the structural differences. New failure mechanisms that appear in build-up stack layers are discussed. Next, emerging...
A dynamic substructural method (DSM) is developed to simulate the board level drop test of a wafer level chip scale package (WL-CSP). Parametric study on package location at the test board, printed circuit board (PCB) thickness and WL-CSP package thickness is conducted in the board level drop test simulations. The peeling stress and first principle stress of the solder joints are checked and discussed...
Higher pin count and reduced pitch along with increased wafer size set new demands to fine pitch wafer probe technology. Vertical buckling probe needles are one of the available concepts. The required elasticity for contacting the pad is achieved by buckling of the needles. The buckling mode guarantees a consistent contact pressure over a large range of overtravel and thus allows for an optimal tolerance...
This paper investigates the electromigration induced hillock generation in a wafer level interconnect structure through numerical approach. The electronic migration formulation that considers the effects of the electron wind force, stress gradients, temperature gradients, as well as the atomic density gradient has been developed. The parameter study for the Al line geometry with different width and...
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