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We presents a micromachined interferometric accelerometer fabricated using Silicon Glass Anodic-bonding and Deep Etching Release (SGADER) process. The accelerometer consists of a glass-silicon-glass sandwich structure. A proof mass is suspended by beams attached to the silicon support substrate and a diffraction grating on the bottom glass substrate resides under the proof mass. The sandwich structure...
In our previous study, we fabricates large grain low temperature poly-crystalline silicon film by aluminum induced crystallization (AIC) method. The fabrication process is to deposite aluminum layer on top of the a-Si:H film deposited by plasma enhanced chemical vapor deposition (PECVD) [1]. In this paper, we discussed more about the effect of different aluminum thickness of the AIC process. Five...
This paper discusses a novel method of modeling and simulation of anodic bonding technique, which is widely used in fabrication of MEMS device and micro system. The emphasis are the bond expansion model and extended time formula of silicon-glass anodic bonding, and based on which, visual simulation of the process is achieved. In practical experiments, by utilizing the math model, simulation result...
This paper experimentally compared the performance of two existing anti-notching methods for silicon on glass structures in deep reactive ion etching process. The two methods employed a same concept, by sputtering an electrically conducting metal layer to evacuate the charges of etching radicals to silicon substrate and eliminate the buildup of electric field. The difference between them is where...
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