The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Through an aggressive product development program which includes experiment and simulation, Amkor has developed the next level of WLCSP (CSPnltrade), a product which exhibits superior board level reliability when subjected to drop impact, a strong requirement for portable electronics. Failure mechanism of WLCSP under drop test has been established. Depending on type of WLCSP and test board design,...
One of the driving factors for a steady reduction in wafer and cell thickness is the present shortage of polysilicon feedstock combined with the need to reduce manufacturing costs in photovoltaic module production. Therefore materials and manufacturing processes must adapt to maintain acceptable mechanical yields and module reliability. The soldering of solar cell strings is a critical step in the...
A set of experimental and computer simulation methods has been applied to reliability analysis of a newly designed resin transfer molded power electronics module for automotive applications, comprising the glass-fiber epoxy multi-layer PCB, populated with various electronic packages. Evaluation of thermo-mechanical stability, determination of moisture ingress, and testing the adhesion quality between...
Power electronics uses semiconductor technology the convert and transmit energy. Power electronics modules such are the core electronic packages that undertake this function. The take up of these technologies is growing dramatically due to the increase in electronics in sectors such as automobiles, aerospace, consumer white goods, and of course green technologies. Designing such modules requires a...
This investigation is aimed at the stability of press-fit interconnections for MID. Moulded interconnect devices (MID) are 3-dimensional substrates produced by thermoplastic injection moulding for large-series applications. The assembly process of press-fit interconnections has been correctly modelled with a FE-Software. With this model the behaviour of the mechanical contact pressure, which decreases...
Environmental test is widely used to verify the adaptability and reliability of various electronic products in the last decades. The sharp change of temperature and humidity in certain situations could pose a serious reliability issue on the electronic components. This paper presents an experimental study of one kind of plastic substrate based flexible display called STN (super-twisted nematic). The...
The numerical pre-design of a novel micro-machined thermal infrared emitter, using a spider type hotplate concept is presented. The spider concept introduced allows the fast transient operation of the emitter and thus a direct modulation of the radiation without additional mechanical tools like choppers. The thermal radiation source is excited by a pulsed electrical voltage and is thermally separated...
The components used in the automotive environment are subjected during their lives to various environmental combined stresses. The predominant failure mechanism at the package level due to these combined stresses is the ball bond lift. The failure is due to the combination of metallurgical effects, such as the intermetallic (IMC) Au-Al thickness growth, widening of Kirkendall voids and mechanical...
High power RF transmitters are essential components for enabling base stations, microwave, and broadcast systems. NXP is a leading RF Power supplier for more than 25 years, and our market share gain with volume. In principle, the market demands high power, high frequency and high efficiency with low thermal resistance: Efficiency larger than 30%, frequency in range of 0.7-2.5 GHz or higher, which...
The paper discusses the increasing need for a more sophisticated thermal characterisation of LEDs (Light Emitting Diodes) and LED-based products. It goes without saying that the LED-business is growing exponentially, in fact, much faster than analysts predicted five years ago. Unfortunately, the progress in thermal characterisation has not kept pace. The situation is becoming a serious problem for...
In power packages, the DC test for RDS(ON), AC test for various parameters, test for fusing current capability, and unclamped inductive load (UIL) or unclamped inductive switching (UIS) test, are important and critical for assurance of the robust product performance, quality and reliability. The fusing current capability test tries to simulate which case has the highest fusing current capability....
The temperature dependent driving force for stress induced voiding of Cu dual damascene interconnects has been studied using finite element modeling. Both 2D axisymmetric and 3D models have been investigated. Interconnect test structures have been simulated at temperatures ranging from 25 to 300degC and a stress free temperature for the structure is demonstrated, consistent with analytical modeling...
The aerospace and high performance (AHP) electronics industry leans henceforth on the technologies developed for consumer applications. However, the requirements of AHP products in terms of reliability are stronger than for consumer ones. One of the factors to improve the reliability in thermal cycling of electronic assemblies is the selection of base materials for Printed Circuit Boards (PCB). In...
The nanoindentation experiment is an established technique for the determination of hardness and Young's modulus of thin films. This standard data set is not sufficient to be used as input to finite element simulations , because elastic-plastic material data is being required for analysis of reliability of metal layers. Therefore stress-strain curves are being determined by fitting the force displacement...
This work will present case studies of three types of flexible printable circuits subjected to different loading conditions in order to evaluate their technologies regarding mechanical reliability. Typical causes of failure in electronic devices are associated with mechanical stress, moisture, heat from transportation and field use. Typically manufacturers carry out tests to evaluate the reliability...
Spontaneous adhesion can seriously jeopardize the reliability of micro-electro-mechanical systems, both during the fabrication phase and in the operation conditions. For this reason, adhesion in MEMS has been the topic of abundant research works in the last decade. This paper aims at the formulation of a computational model in order to simulate the adhesion phenomena in various environmental conditions...
The aim of qualification is to verify whether a product meets or exceeds the reliability and quality requirements of its intended application. Qualification plays an important role in the process of product development. It can be classified by its specific purpose at different stages of the product development process. In this paper, a new methodology of product qualification is proposed based on...
In this paper, a leading indicators based approach has been developed for prognostics and health monitoring of electronic systems. The approach focuses on the prefailure space and methodologies for quantification of damage progression and residual life in electronic equipment subjected to shock and vibration loads using the dynamic response of the electronic equipment. Traditional health monitoring...
With the increased complexity of SiP (system in package), Finite Element simulations take an important role in predicting the thermo-mechanical package reliability. Failures in flip chip packages such as die cracking and fatigue of solder bumps are specially the result of the mismatch in thermal expansion coefficients between die and the substrate. In some packages, we use an underfill to improve...
Reliability of SnAgCu solder joints under mechanical stress is not proven, in particular for Aeronautic and High Performance (AHP) products. They are subjected to high temperatures, severe mechanical stresses and long-term mission profiles. This work is comprehended within a larger study, which has as objective the characterization of the SnAgCu alloys mechanical behaviour at the solder joint scale...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.