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An advanced sensor node for direct tire pressure monitoring is presented, where the shock-sensitive crystal is replaced by a bulk acoustic wave (BAW) based resonator. Since the applied components are arranged in a 3D integrated stack, a wide range of new design issues arise. This paper investigates system issues due to temperature gradients in a 3D stack as well as the radio frequency (RF) characteristics...
Due to high integration density the influence of manufacturing technologies on the system behavior has to be considered in the design process of 3D systems. Therefore, information from different physical domains has to be provided to designers. The variety of structures and physical effects requires efficient modeling approaches and simulation algorithms. In the following a modular approach which...
The detailed evaluation of a PCB-based microfluidic sensor directly integrated on a polymeric microchannel is presented in this work. The sensor consists mainly of polymeric materials, therefore the operational characteristics are enhanced due to the high level of thermal isolation. The maximum measurement range was 0-400 mul/min which occurs in hot-wire operation, while under the calorimetric operating...
This paper reports on the design and fabrication of integrated thermal sensors or thermal sources for various MEMS applications and particularly microfluidics applications. The capabilities of polysilicon diodes as thermal sensors are demonstrated with good thermal sensitivities (55 mV/degC). An instrumentation platform has also been developed to measure the temperature variations through microchannels.
We present a study on the use of corona discharge surface treatment to achieve a fast thermal diffusion bonding process for the creation of microfluidic chips. Wafer level bonding at 100 mm diameter was attempted. Polymethyl methacrylate (PMMA) wafers were hot embossed to create microchannels before bonding to another blank PMMA wafer. Corona discharge treatment of the PMMA resulted in a more hydrophilic...
The effectiveness of a new offset compensation technique for integrated thermal flow meters is demonstrated. A sensor structure based on two heaters placed between two temperature probes is designed with a commercial CMOS process and fabricated by means of a post-processing technique. The power unbalance between the two heaters is used to compensate the intrinsic sensor offset. Experiments, performed...
Plastic packaging is the mainstream on microelectronic packaging technology at present. As the continuous requirements for smaller but higher density products, failure and reliability issues on MEMS/MOEMS packaging because of the hygroscopic swelling mismatch stress become more and more serious. To this end, this paper presented the stress monitoring methodologies as well as the reliability tests...
In this study, performance of heat sinks using the copper foams as heat-sinking material is investigated experimentally. The copper foam is fabricated by electroplating technique using polymer foam with pre-coated silver film as the precursors. The manufactured copper foams have the porosity, pore density (pore per inch, PPI), permeability and inertial coefficient in the ranges of 0.5~0.8, 10~40,...
We present a bidirectional electrothermal microgripper for the advanced manipulation of single large cells. The device demonstrates excellent performance, and shows great potential as a supporting microtool for different biomedical procedures such as oocyte selection or electrofusion of cells. In particular, we focus on the operation of the device in real environments, i.e. integrated in a standard...
Glass frit bonding is an important technology for the hermetical encapsulation of microsensors. During the manufacturing process or in application the bonding layer is repeatedly exposed to temperature changes. Therefore a meaningful stability assessment must include temperature dependent fracture toughness parameters. This work shows that the influence of temperature changes on the fracture toughness...
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