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The mechanical fatigue behavior of gold components for MEMS applications is analyzed; an experimental procedure to measure the lifetime of components under alternate loads with different mean stress conditions is presented. Dedicated devices were designed and built able to produce alternate loading on the embedded specimens; the electrostatic actuation is used as driving force. Gold microbeams are...
Dynamic behavior of oscillating perforated gold plates under the effect of squeeze film damping is analyzed by means of experimental measurements and a compact model. Thin plates built with the surface micro-machining technique and gold electroplating were designed with many different geometrical dimensions for the plate and the holes; the number of holes is also variable. Altogether, samples with...
3D integration of micro electromechanical systems (MEMS) is expected to reduce the foot print of existing MEMS products and enable production of miniaturized sensor nodes on a large scale. However, 3D integration of MEMS is in general different from 3D integration of planar integrated circuits (ICs) due to additional mechanical requirements. Specifications regarding properties like stiffness, volume,...
Micro-Electro-Mechanical System (MEMS) RF switches have been one of the most interesting areas for research and development in the last years. It has been shown that they have an excellent performance in the RF and microwave frequency range and a great effort has been dedicated in designing suitable geometries and structures best suited for switching application. In parallel other devices useful for...
ldquoSystem-in-Packagerdquo is a key concept to achieve minimum size and costs in hybrid integration. We investigated several related technologies for inertial sensor MEMS packaging, with special emphasis on vacuum packaging of resonant devices like gyroscopes: Hermetic Chip-to-Wafer and Wafer-to-Wafer bonding, Through-Silicon Via in thick and in thin wafers, thin-film getter deposition and fine patterning,...
A novel fiber-optic localized plasma resonance (FO-LPR) biosensor composed of a U-shaped optical fiber was proposed and demonstrated in the present study. The U-shaped optical fiber was fabricated by a femtosecond laser micromachining system. It was 105 mum in depth measured from the surface of the polymer jacket layer and 80 mum in width in the jacket layer. After treatment of annealing, the mean...
A paddle-like cantilever beam was designed and developed as a specimen to measure the mechanical behavior of thin films. This beam is in triangle shape in order to provide uniform plane strain distribution and standard clean room processing was used to prepare the sample. The residual stress measurement of thin films application for MEMS were studied with the deflections of silver, gold, and copper...
Recent years have shown the tremendous growth of electronic use in medical devices. Especially active implants and hearing aids have driven that trend to today's ultra-small devices embedded into the body. While the integrated circuits' features a ever-decreasing critical geometries and surging performance numbers, the delivery format of such advanced chips is seldom providing the engineering teams...
Stiction of MEMS (microelectromechanical system) switches for RF (radio frequency) applications is a critical issue as it may jeopardize temporarily or permanently the operability of such devices. In this work we present a novel mechanism to enable the self-recovery of RF-MEMS switches in case of stiction. It is based on the application of a restoring force on the stuck membrane, induced by the thermal...
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