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In the late years, many countries will begin to prohibit using the lead-based solders in microelectronic packaging processes in view of inherent toxicity of lead-based solder alloys. The waste electrical and electronic equipment (WEEE) directive by EU has claimed that the use of Pb in consumer electronics will be banned after January 2006. Therefore, the development of lead-free solders replacing...
Especially in the handheld context, we need always greater guarantees in product efficiency. Mobiles, notebooks, organizers, cameras etc. are assets whose use increases the probability of downfall. When an electronic product drops on the ground, impact force and deformation is transferred internally to the printed circuit board (PCB), solder joints and the integrated circuits (IC) packages. The IC...
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