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In this study, a wafer level chip scaled packaging (WLCSP) having the capability of redistributing the electrical circuit is proposed to resolve the problem of assembling a fine-pitched chip to a coarse-pitched substrate. In the fan-out WLCSP, the solder bumps could be located on both the filler polymer and chip surface. The concept of the fan-out WLCSP and the processes of fabricating the novel fan-out...
In the late years, many countries will begin to prohibit using the lead-based solders in microelectronic packaging processes in view of inherent toxicity of lead-based solder alloys. The waste electrical and electronic equipment (WEEE) directive by EU has claimed that the use of Pb in consumer electronics will be banned after January 2006. Therefore, the development of lead-free solders replacing...
Nowadays, there are numbers of pad finishing types in market for ball grid array package (BGA). OSP (organic solderability preservatives) pad finishing technology is one of the most widely used for the purpose of increasing the joint strength and achieving more excellence in heat-resistance. Especially, to develop the ICs products to have compatibility with non-clean soldering fluxes and solder paste...
Especially in the handheld context, we need always greater guarantees in product efficiency. Mobiles, notebooks, organizers, cameras etc. are assets whose use increases the probability of downfall. When an electronic product drops on the ground, impact force and deformation is transferred internally to the printed circuit board (PCB), solder joints and the integrated circuits (IC) packages. The IC...
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