We report a hetero-epitaxial growth of cubic single crystalline HfO 2 film on Si substrates as high k materials by pulse laser ablation (PLA) at 820°C. To eliminate the interfacial defects, the HfO 2 film has then been annealed at 900°C for 5min in N 2 . Reflection high-energy electron diffraction (RHEED) results indicate orientation of the HfO 2 film on Si substrates corresponding to (001)HfO2∥(001)Siand[011]HfO2∥[011]Si. An interface layer has been revealed by high-resolution transmission electron microscope (HRTEM). Through capacitance–voltage (C–V) and current–voltage (I–V), it has been obtained that the leakage current of the HfO 2 gate insulator with dielectric constant of 26 is 5×10 −6 A/cm 2 at −1V.