Archives of Foundry Engineering > 2018 > Vol. 18, iss. 1 > 87--92
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journal ISSN : | 1897-3310 |
journal e-ISSN : | 2299-2944 |
DOI | 10.24425/118817 |
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Bibliography
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[1] Liang Zhang, Song-bai Xue, Li-li Gao, Zhong Sheng, Huan Ye, Zheng-xiang Xiao, Guang Zeng, Yan Chen & Sheng-lin Yu. (2010). Development of Sn-Zn lead-free solders bearing alloying elements. Journal of Materials Science: Materials in Electronics. 21, 1-15.
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[2] Kudyba, A. (2016). Perspectives and directions for the development of new-generation lead-free solder and the possibility of their application in lead-free solder technology of consumer electronics. Prace Instytutu Odlewnictwa/Transactions of Foundry Research Institute. LVI(3), 233-260. (in Polish).
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[3] Song, J.M., Lan, G.F., Lui, T.S. & Chen, L.H. (2003). Microstructure and tensile properties of Sn–9Zn–xAg lead-free solder alloys. Scripta Materialia. 48, 1047-1051.