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Failure location and mechanism analysis about a microsystem fault is presented in this work. The fault phenomenon of abnormal low output power amplitude appears only at low temperature during thermal cycle test. A series of analysis including internal fault location and replacing parts for validation help to find the fault origin: a line winding inductor. The failure mechanism of the failed inductor...
The solder points cracking of a component with package of ceramic ball grid array (CBGA) type is studied in the paper. The cracking cause is found and the failure mechanism is clarified. The weakness of the package structure design is demonstrated by comparing the experiment results of two kinds of components, which provides guidance for the reliable design and application.
Web service composition integrating several single services by logical structure can fulfill users' complex requests while a single one cannot do this. As one of service's nonfunctional components, quality of service (QoS) can be used as the criteria for service selection process and evaluation of composition results. However, so far there is no suitable method to estimate composition result and existing...
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