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In this paper, we first propose and demonstrate an interposer-level wireless power transfer (WPT) scheme to reduce the number of wired power supply interconnections for high-density silicon interposer-based 2.5-D and 3-D integrated circuits (2.5-D and 3-D ICs). We first suggest the concept of an active silicon interposer, fabricate it with active circuits for WPT, and finally proved its WPT operation...
In this study, magnetically coupled coil design for high efficiency wireless power transfer (WPT) in PCB-toactive silicon (Si) interposer is proposed and analyzed using Z-parameter analysis. For strong magnetic coupling between transmitter (Tx) coil on PCB and receiver (Rx) coil on Si-interposer, each coil structure is selected considering process dimension difference between PCB and Si-interposer...
In this study, a Wireless Power Transfer (WPT) system design on active silicon (Si) interposer for low voltage applications in 3D-IC is proposed. The proposed WPT system includes magnetically coupled coils, a full-bridge rectifier, and a voltage regulator. In order to validate the proposed system, we first design all of the system components. First, we design a three dimensional helix-type transmitter...
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