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RF-CMOS process employing 14nm FinFET technology is introduced for the first time and its RF performance is characterized. Compared with its 28nm planar counterpart, the optimized 14nm RF FinFET consumes 63% of DC power with 53% of device active area and 3.8 times higher intrinsic gain (gm/gds). Based on the 14 nm technology, VNCAP with higher cap density (8%) and Q-factor (23%) is also verified for...
This paper presents the design of a dynamic vision sensor for mobile applications. The sensor features a standby mode with less than 250uW of power dissipation. The sensor changes operation mode between standby and normal operation itself depending on input activity. The power consumption in normal operation mode is typically 500uW and activity dependent. The sensor design is implemented in a 90nm...
The control of a nonlinear system is a challenging problem particularly when the system has some uncertainty or there are imperfections in the model dynamics. One approach that has gained some success employs a fuzzy structure in concert with a neural network (ANFIS); the fuzzy component compensates for the uncertainty while the neural network component models the underlying system dynamics. This...
RFID systems are based on backscattering communications, and this encourages research on how to guarantee a reliable RX performance under simultaneous TX/RX operation. To isolate RX from the TX self-jammer, the RFID transceivers are generally accompanied by an off-chip circulator or isolator. This has advantages in selectivity between tag signal and blocker, but it results in a low level of integration...
Increased functionality requirements coupled with progressively reducing package size have necessitated the integration of flip chip packages into various baseband and application processor products in mobile platforms. Such products use flip chip technology using traditional capillary underfill (CUF) process on a strip based package which is subsequently over molded to finish the end-product assembly...
Existing budgeting tools take only the short-term view; here, we present an interface for scenario-based, long-term planning. Our work is grounded in recent empirical advances in behavioral economics. We present a system architecture and suggest contributions and directions for future research.
In this paper we present new approaches in the development of flip chip technology for mobile platforms. We assess the challenges presented by the use of flip chip interconnection as opposed to the traditional approach of wire bonding and present innovative solutions developed to address those challenges. In particular, we describe innovations in the area of routing-efficient interconnection, bumped...
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