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3D integration by TSV approach is a very hot topic now as an enabling technology for 3D wafer-level packaging and 3D IC. Re-distribution layer (RDL) process becomes more critical on high volume Cu (TSV) wafer because of Cu thermal stress effect. Fine pitch low temperature RDL is required in 3D packaging and 3D IC integration. We develop fine pitch (5μm space/5μm width) single and dual damascene processes...
3D integration by TSV approach is a very hot topic now as an enabling technology for 3D wafer-level packaging and 3D IC. Re-distribution layer (RDL) process becomes more critical on high volume Cu (TSV) wafer because of Cu thermal stress effect. Fine pitch low temperature RDL is required in 3D packaging and 3D IC integration. We develop fine pitch (5µm space/5µm width) single and dual damascene processes...
This study serves to validate the predictive finite element modeling approach for the solder joint thermal fatigue life analysis, with emphasis on the applicability to various lead-free solder joints. The three packages involved in the study are 8??8 mm PBGA, l0??l0 mm QFN, and 51??51 mm CBGA. They are designed to consist of SAC387, SAC305, ??SAC305 ball + SAC387 paste?? and ??SAC387 ball + SAC305...
A microfabricated neural thermocouple arrays probe (NTAP) is proposed for measuring and comparing the temperature of local brain area in real time sensing. Four junctions of T type thin film thermocouple arrays were fabricated on a sharp silicon probe tip. Each junction size was 20 mum by 20 mum. The average seebeck coefficient was 15.12 muV/oC and the dynamic response time was 0.78 sec. The temperature...
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