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Increasing demand for computing power in scientific and engineering applications has spurred deployment of high-performance computing clusters. According to the TOP500 list, an industry respected report of the most powerful computer systems, the high-performance computing market entered the Teraflop era in 2005 (the entry point on the list became greater than 1 Teraflop) and anticipates entering the...
As the conversion of the electronics industry to lead free soldering materials continues some unexpected negative side effects of higher lead free reflow temperatures have occurred. Component level defects such as delamination and "popcorning" in surface mount IC lead frame components have increased significantly since lead free soldering has become mainstream. Popcorning and delamination...
As PCB signal speeds increase, the signal's current path switches from the path of least impedance to the path of least inductance. This path of least inductance is what is commonly known as the "skin effect" whereby an AC signal primarily flows nearer to the outside surfaces of a copper conductor rather than through the entire cross section of the conductor. As frequencies increase, the...
Leakage and dielectric breakdown of SiO2 are studied for Cu interconnect structures with either stand-alone CoWP or two-layer CoWP+SiN caps. Without a post-CoWP plasma clean, there are many early fails and the dielectric breakdown exhibits bimodal behavior. By adding a plasma clean after CoWP deposition, the early fails can be eliminated and high dielectric breakdown is achieved. The improvement in...
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