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We developed a 25-Gb/s transmitter with an over-drive of 10-Gb/s VCSEL using our asymmetric pre-emphasis design. Owing to the narrow spectral width characteristics of our transmitter, we demonstrate 25-Gb/s transmission over 250-m of multimode fiber.
We developed optical interconnect technologies, i.e., an optical mid-plane, high-density connector, and a compact transceiver for future servers that enable high-bandwidth and dense integration. Using these technologies, 1500 optical connections and 37.5 Tb/s of bandwidth were built in a blade-server form factor.
We have developed a cost-effective on-board optical interconnection sheet using a polymer waveguide with flexible printed circuit optical engines. Error-free operation up to 14 Gb/s was demonstrated using a 12-ch optical interconnection sheet.
We developed a 25-Gb/s VCSEL transmitter with 10-Gb/s VCSEL. By driving standard 10-Gb/s VCSELs using pre-emphasis technology to overcome their optical bandwidth limit, we achieved clear eye opening at 25 Gb/s.
Numerical simulations for understanding fundamental characteristics of the surface plasmon polariton gap waveguide (SPGW) has been demonstrated. The SPGW excited through an aperture have been demonstrated by the three-dimensional simulations using a volume integral equation method. Complex propagation constants calculated by the Method of Lines (MoL) has been shown. Applications of SPGWs to the nanosize...
We propose high speed optical interconnection which is three dimensional optical lanes using polymer materials fabricated on an organic circuit board with metal lines and pads. These optical lanes transmit optical signals not only on a plane surface but into the other side of a circuit board. It has following three particular portions; (1) curved parallel optical waveguide; (2) 45 degree reflection...
A new two-dimensional array optical interconnection construction is developed for the board-to-board level. A high throughput density of 21 Gbit/s/cm/sup 2/ over the electric coaxial cable limit is achieved by the direct hybridisation of an 8*2-channel LD/PD array onto the transmitter/receiver IC and surface-mount packaging of a microlens array and a fibre-connector receptacle.<<ETX>>
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