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This paper presents an extensive numerical analysis of the thermal behavior of InGaP/GaAs HBTs in a laminate (package) environment. The combination between the Design of Experiments technique and a fast and accurate simulation capability is adopted to quantify the impact of all the key technology parameters and explore a wide range of operating conditions.
Roman plasters sampled from different houses at the archaeological site of Herculaneum, Italy, (2010–12) were studied by means of petrography, thermal analysis and X‐ray fluorescence. Herculaneum plasters are composed by preparatory layers (arriccio) with a thickness of several centimetres and are based on a calcitic binder and volcanic scoriae as aggregates, covered by a thin final layer characterized...
This paper presents a fast and accurate approach for the dynamic electrothermal analysis of photovoltaic (PV) plants with a cell-level discretization. A circuit model is developed for the elementary cell, and an equivalent electrical network is automatically built in a preprocessing stage to account for the power-temperature feedback. The PV plant under analysis is represented as an electrical macrocircuit...
This paper presents a computationally efficient 3-D simulation approach for the dynamic electrothermal analysis of SiC power MOSFETs. The strategy relies on a circuit representation of the whole device, where the electrothermal feedback is enabled through an equivalent electrical network, and the elementary device cell is described by a novel behavioral model accounting for the non-intuitive temperature...
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