The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
A 3D packaging based 4-channel X-band receiver module is implemented using low temperature co-fired ceramic (LTCC) technology. A dual-mode X-band bandpass filter (BPF), an lumped-element branch-line coupler and an lumped BPF is proposed for the receiver module, respectively. The overall size of the module is only 54 mm × 60 mm × 1 mm. The measured gain parameter, noise figure (NF), image rejection...
In order to reduce the cost of solder materials and retard the thermal shock of temperature-sensitive electronic components during packaging process, SnBi solder paste was explored to replace SnAgCu solder paste due to the low melting temperature. In this study, BGA structure Cu/solder-ball/solder-paste/Cu joints were designed and prepared to study the interfacial reactions and microstructural evolution...
The dynamic wetting behavior and formation of solder ball spattering of Sn-58Bi solder paste on Cu substrate during reflow soldering process were studied by the soldering interrupt test method; meanwhile, the formation mechanism of solder ball spattering was analyzed. Further, the effect of reflow process parameters on the severity of solder ball spattering defect during reflow soldering process was...
Size effect of solder balls on the interfacial reaction and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints during isothermal aging at 125 °C was systematically investigated. Results show that a large amount of bulk Cu6Sn5 phase distributes in the solder matrix of joints with large solder ball size, resulting from larger outflux Cu atoms from the interface...
In order to adapt the harsh service condition of the interconnects between the power semiconductors (chips) and substrates, there is an urgent need to develop alternative interconnect materials. Hybrid silver pastes consisting of microscale Ag flakes, nanoscale or sub-microscale Ag particles and volatile solvents have been considered as one of the most promising candidates. In this study, a hybrid...
A novel impedance matching method of a helix antenna is proposed in this paper. The conventional impedance matching of a helix antenna is based on the method of adjusting the thickness of the substrate and making a tapered transition between the helix antenna and the coaxial cable. However, these methods are not easy to be controlled. This paper designed an improved impedance matching method, using...
The solder joint's volume and interfacial reaction during the soldering significantly affect its solidification behavior and microstructure feature; further, the microstructure of the solder matrix and the intermetallic compounds (IMC) have a direct impact on the performance and reliability of the solder joint. In this study, the effects of the solder volume and interfacial reaction on the undercooling...
The solder joint's volume and interfacial reaction during the soldering significantly affect its solidification behavior and microstructure feature; further, the microstructure of the solder matrix and the intermetallic compounds (IMC) have a direct impact on the performance and reliability of the solder joint. In this study, the effects of the solder volume and interfacial reaction on the undercooling...
The effect of the activators and surfactants in halogen-free fluxes on the wettability of Sn-0.7Cu-0.05Ni solder on Cu substrate (or under bump metallization, UBM) was investigated in this study. The spreading area of Sn-0.7Cu-0.05Ni solder on Cu substrate was used to estimate the wetting performance of the solder influenced by the activators with different amounts added in halogen-free fluxes. The...
During soldering process employing Sn-based lead-free solders, an intermetallic compound (IMC) layer forms between the molten solder and pad/under bump metallization (UBM), whose morphology and thickness play an important role in controlling the service performance of the solder joints, in particular for solder interconnects with the decreasing size where the interfacial IMC layer takes up a high...
The morphological evolution of Cu6Sn5 grains formed at the interfaces of “Sn-3.0Ag-0.5Cu/Poly-crystal Cu (PC-Cu)” and “Sn-3.0Ag-0.5Cu/Single crystal Cu (SC-Cu)” under different reflow conditions was investigated. Reflow experiments were performed at different peak temperatures of 230, 260 and 290°C corresponding to the dwelling time of 20s, 60s and 600s, respectively. The results show that Cu6Sn5...
This paper compares performances of several bandwidth expansion approaches of bond wire interconnection on low temperature co-fired ceramic (LTCC) substrate. Approaches using multiple bond wires match, lumped element match, rectangle stub match, radial stub match, butterfly stubs match and “L” shape gap match are included in the comparison. Moreover, Slow-wave effect constructed with bond wires is...
PZT films were deposited by a sol-gel method on platinized silicon substrates with different types of layer materials, such as silicon nitride and silicon oxide. The crystallographic orientations of the PZT films were controlled by combined parameters of a chelating agent and pyrolysis temperature. A nanoindentation CSM (continuous stiffness measurement) technique was utilized to characterize the...
The PZT films were deposited by the solgel method on platinized silicon substrates with different types of layer materials, such as silicon nitride and silicon oxide. The crystalline orientations of the PZT films were controlled by combined parameters of a chelating agent and pyrolysis temperature. A nanoindentation CSM (continuous stiffness measurement) technique was utilized to characterize the...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.